ダン ナム カイン

ダン ナム カイン DANG Nam Khanh

准教授

所属
コンピュータ理工学科/コンピュータ・サイエンス部門
職位
准教授
E-Mail
khanh@u-aizu.ac.jp
Webサイト
https://u-aizu.ac.jp/~khanh/

教育

担当科目 - 大学
担当科目 - 大学院

研究

研究分野
- Neuromorphic Computing
- Machine Learning
- Fault-tolerance
略歴
Educational Background
- Ph.D. in Computer Science and Engineering, The University of Aizu, Japan, 2017
- M.Sc. in Information Systems & Technology, University of Paris-XI, France, 2014
- B.Sc. in Electronics & Telecommunications, VNU University of Engineering and Technology, Vietnam, 2011

Work Experience
- Associate Professor, The University of Aizu, 2022 April - now.
- Assistant Professor, VNU University of Engineering and Technology, Vietnam National University, Hanoi, 2017 November - 2022 March.
- Visiting Researcher, The University of Aizu, 2020 November - 2021 March.
- Visiting Researcher, The University of Aizu, 2019 May - 2019 September.
- Researcher, SISLAB, Vietnam National University, Hanoi, 2011-2014.
- RTL Designer, Dolphin Vietnam Inc., 2010-2011.
現在の研究課題
研究内容キーワード
Neuromorphic Computing, Faul-tolerance, VLSI, 3D Integrated Circuits
所属学会

パーソナルデータ

趣味
子供時代の夢
これからの目標
座右の銘
愛読書
学生へのメッセージ
その他

主な著書・論文

Selected Publications:

- Duy-Anh Nguyen, Xuan-Tu Tran, Khanh N. Dang, and Francesca Iacopi, “A Low-Power, High-Accuracy with Fully On-Chip Ternary Weight Hardware Architecture for Deep Spiking Neural Networks”, Microprocessors and Microsystems, Elsevier, Volume 90, pp. 104458, 2022. [DOI: 10.1016/j.micpro.2022.104458].

- Khanh N. Dang, Nguyen Anh Vu Doan, Abderazek Ben Abdallah “MigSpike: A Migration Based Algorithm and Architecture for Scalable Robust Neuromorphic Systems”, IEEE Transactions on Emerging Topics in Computing (TETC), [DOI: 10.1109/TETC.2021.3136028].

- Abderazek Ben Abdallah, Khanh N. Dang, “Towards Robust Cognitive 3D Brain-inspired Cross-paradigm System”, Frontiers in Neuroscience, Frontiers, Volume 15, pp. 795, 2021. [DOI: 10.3389/fnins.2021.690208].

- Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran, “HotCluster: A thermal-aware defect recovery method for Through-Silicon-Vias Towards Reliable 3-D ICs systems”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, IEEE, Volume 41, No. 4, pp. 799-812, April 2022. [DOI: 10.1109/TCAD.2021.3069370].

- Khanh N. Dang, Akram Ben Ahmed, Ben Abdallah Abderrazak and Xuan-Tu Tran, “TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC Systems”, IEEE Transactions on Very Large Scale Integration Systems (TVLSI), IEEE, Volume 28, Issue 3, pp. 672 - 685, 2020. [DOI: 10.1109/TVLSI.2019.2948878].

- Khanh N. Dang, Michael Meyer, Akram Ben Ahmed, Abderazek Ben Abdallah, and Xuan-Tu Tran, “A non-blocking non-degrading multi-defect link test method for 3D-Networks-on-Chip”, IEEE Access, IEEE, Volume 8, pp. 59571 - 59589, 2020. [DOI: 10.1109/ACCESS.2020.2982836].

- Khanh N. Dang, Akram Ben Ahmed, Yuichi Okuyama, Abderazek Ben Abdallah, “Scalable design methodology and online algorithm for TSV-cluster defects recovery in highly reliable 3D-NoC systems”, IEEE Transactions on Emerging Topics in Computing (TETC), IEEE, Volume 8, Issue 3, pp. 577-590, 2020. [DOI: 10.1109/TETC.2017.2762407].

- Khanh N. Dang, Akram Ben Ahmed, Xuan-Tu Tran, Yuichi Okuyama, Abderazek Ben Abdallah, “A Comprehensive Reliability Assessment of Fault-Resilient Network-on-Chip Using Analytical Model”, IEEE Transactions on Very Large Scale Integration Systems (TVLSI), IEEE, Volume 25, Issue 11, pp. 3099-3112, 2017. [DOI: 10.1109/TVLSI.2017.2736004].

https://u-aizu.ac.jp/~khanh/#publications