Patent

Google Patents List: https://patents.google.com/?inventor=Nam+Khanh+Dang

NOTE: Underlined inventors are students under my direct supervision.

Patent Pending

  1. Khanh N. Dang, A. Ben Abdallah, Nguyen Ngo Doanh, '’Neural Network Processor’’ [ニューラルネットワークプロセッサ], 特願 2024-047372, Japan patent, (filed patent).
  2. Abderazek Ben Abdallah , Zhishang Wang, Khanh N. Dang, Masayuki Hisada, ’’ Lacquering Robot System [漆塗りロボットシステム]’‘, 特願2024-056380, Japan patent, (filed patent).
  3. Khanh N. Dang, A. Ben Abdallah, '’Program for generating migration flows for homogeneous computing systems and homogeneous computing devices” [ホモジニアスコンピューティングシステム及びホモジニアスコンピューティングデバイスのマイグレーションフローの生成プログラム], 特願 2022-196416, Japan patent, (filed patent). [Google Patent]
  4. A. Ben Abdallah, Zhishang Wang, Khanh N. Dang, Masayuki Hisada, '’EV Power Consumption Prediction Method and System for Power Management in Smart Grid [スマートグリッドにおける電力管理のためのEV消 費電力予測 方法とシステム ]”, 特願2020-194733, Japan patent, 2022 (filed patent). [Google Patent]
  5. A. Ben Abdallah, Huakun Huang, Khanh N. Dang, Jiangning Song, '’ＡＩプロセッサ (AI Processor)’‘, 特願2020-194733, Japan patent, (patent pending). [Google Patent].
  6. A. Ben Abdallah, Khanh N. Dang, Masayuki Hisada, '’Distance-aware Extended Parity Product Coding for multiple faults detection for on-chip links’‘, 特許第7488989号, Japan patent, (patent pending) [Google Patent].

Granted Patent

  1. A. Ben Abdallah, Khanh N. Dang, '’An on-chip 3D system in which TSV groups containing multiple TSVs connect layers together [複数のＴＳＶを含むＴＳＶグループが層間を接続するオンチップの３次元システム]’‘, 特許第7488989号, Japan patent, [Certificate], [Google Patent].
  2. A. Ben Abdallah, Khanh N. Dang, Masayuki Hisada, '’TSV Error Tolerant Router Device for 3D Network On Chip’‘, 特許第7239099号, Japan patent, [Certificate], [Google Patent].