Fault-tolerant On-chip Interconnects (2D/3D-ICs, Si-Photonics, Hybrid)


Complex SoCs contain dozens of components made of processor cores, DSPs, memory, accelerators, and I/O, all integrated into a single die area of just a few square millimeters. Such complex systems will be interconnected via a complex on-chip interconnect closer to a sophisticated network than current bus-based solutions. This network must provide high throughput and low latency while keeping area and power consumption low. Our research effort is about solving several design challenges to enable such new paradigm in massively parallel many-core systems. In particular, we are investigating fault-tolerance, 3D-TSV integration, photonic communication, low-power mapping techniques, and low-latency adaptive routing.

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