A patent has been granted for a non-blocking multiple-TSV defects localization method and architecture for 3D-ICs by Prof. Ben Abdallah Abderazek and Prof. Dang Nam Khanh of the University of Aizu.

Please see more about this technology on the following webpage for reference.


Title of the invention :An on-chip 3D system in which TSV groups containing multiple TSVs connect layers together/複数のTSVを含むTSVグループが層間を接続するオンチップの3次元システム.
Inventors : Ben Abdallah Abderazek (Computer Engineering Division) (*1)
       Dang Nam Khanh (Computer Engineering Division)(*2)
Filing date: May 29, 2020 [Application number] 2020-094220
Registration date: May 15, 2024 . Japanese Patent No.7488989
Link to patent :publication of applicationsJPB 007488989-000000.pdf

*1 Prof. BEN ABDALLAH Abderazek

*2 Prof. DANG Nam Khanh