The University of Aizu has been granted a patent for a technology invented by Prof. Ben Abdallah Abderazek and Prof. Dang Nam Khanh.
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お知らせ
A patent has been granted for a non-blocking multiple-TSV defects localization method and architecture for 3D-ICs by Prof. Ben Abdallah Abderazek and Prof. Dang Nam Khanh of the University of Aizu.
Please see more about this technology on the following webpage for reference.
https://www.u-aizu.ac.jp/misc/neuro-eng/3d-noc.html
Title of the invention :An on-chip 3D system in which TSV groups containing multiple TSVs connect layers together/複数のＴＳＶを含むＴＳＶグループが層間を接続するオンチップの３次元システム.
Inventors : Ben Abdallah Abderazek (Computer Engineering Division) (*1)
Dang Nam Khanh (Computer Engineering Division)(*2)
Filing date: May 29, 2020 [Application number] 2020-094220
Registration date: May 15, 2024 . Japanese Patent No.7488989
Link to patent :【publication of applications】JPB 007488989-000000.pdf