Research Interests

Abderazek Ben Abdallah's research is dedicated to advancing energy-efficient, high-performance computing systems, with a particular emphasis on digital signal processing workloads constrained by computational, network, and reliability challenges. His work in neuromorphic AI circuits and systems encompasses energy-efficient learning algorithms and AI-chip hardware development, driving innovation in real-time embedded applications. He has also contributed to the advancement of on-chip interconnects, particularly fault-tolerant 3D-NoCs/ICs (SiPh, Hybrid), designed to optimize system efficiency. Additionally, his research enhances the reliability of integrated circuits and SoCs by tackling key challenges like thermal management and error mitigation. His pioneering algorithms and systems have been instrumental in advancing numerous emerging applications and have been patented across multiple innovations through collaborations with various industrial partners.

Recent News

• [2025.04.28] Our 2nd edition Book entitled ''Neuromorphic Computing Principles and Organization, 2nd Edition,'' Released!
  
• [2025.04.16] A new patent (Nbr.7659250) has been granted (Title: Multiple error detection circuit detecting multiple errors in multiple links and error correction circuit having multiple error detection circuit
• [2021/05/25] Our Off-grid AI-Enabled Energy Management Project Field Demonstration - research  in collaboration with Aizu Computer Science Laboratory and Banpu Japan, 2021/05/25
• [2024.10.25] Our Lab is also affiliated with Carbon Neutral Laboratory, will present about ''AI-powered EV Energy Harvesting and Management'' at the Aizu IT Autumn Forum 2024, Oct. 25, 2024
• [2024.07.07] A patent has been granted for a non-blocking multiple-TSV defects localization method and architecture for 3D-ICs, July 2, 2024.
• ...more

Selected Publications

1. Abderazek Ben Abdallah (Author), Khanh N. Dang (Author), ''Neuromorphic Computing Principles and Organization’’, 2nd Edition, Publisher: Springer; 2025. Link: https://link.springer.com/book/9783031830884, Publication date: Q1, 2025, ISBN-10: 3031830881, ISBN-13: 978 3031830884

2. N. -D. Nguyen, K. N. Dang, A. B. Ahmed, A. Ben Abdallah and X. -T. Tran, "NOMA: A Novel Reliability Improvement Methodology for 3-D IC-based Neuromorphic Systems,” IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2024.3488113.

3. N. -D. Nguyen, A. B. Ahmed, A. Ben Abdallah, and K. N. Dang, "Power-Aware Neuromorphic Architecture with Partial Voltage Scaling 3-D Stacking Synaptic Memory," in IEEE Transactions on Very Large-Scale Integration (VLSI) Systems, vol. 31, no. 12, pp. 2016-2029, Dec. 2023, doi: 10.1109/TVLSI.2023.3318231.

4. W. Y. Yerima, K. N. Dang and A. B. Abdallah, "R-MaS3N: Robust Mapping of Spiking Neural Networks to 3D-NoC Based Neuromorphic Systems for Enhanced Reliability,” IEEE Access, vol. 11, pp. 94664-94678, 2023

5. K. N. Dang, N. A. V. Doan and A. Ben Abdallah, "MigSpike: A Migration Based Algorithms and Architecture for Scalable Robust Neuromorphic Systems,” IEEE Transactions on Emerging Topics in Computing, vol. 10, no. 2, pp. 602 617, 1 April-June 2022, doi: 10.1109/TETC.2021.3136028.

6. Abderazek Ben Abdallah, Khanh N. Dang, “Toward Robust Cognitive 3D Brain-inspired Cross-paradigm System,'' Frontiers in Neurosciences 15:690208, doi: 10.3389/fnins.2021.690208

7. K. N. Dang, A. B. Ahmed, A. B. Abdallah and X. -T. Tran, "HotCluster: A Thermal-Aware Defect Recovery Method for Through-Silicon-Vias Toward Reliable 3-D ICs Systems,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 41, no. 4, pp. 799-812, April 2022, doi: 10.1109/TCAD.2021.3069370

8. A. B. Ahmed, T. Yoshinaga and A. Ben Abdallah, "Scalable Photonic Networks-on-Chip Architecture Based on a Novel Wavelength-Shifting Mechanism," IEEE Transactions on Emerging Topics in Computing, vol. 8, no. 2, pp. 533-544, 1 April-June 2020, doi: 10.1109/TETC.2017.2737016.
   

9. The H. Vu,Yuichi Okuyama, Abderazek Ben Abdallah, “Comprehensive Analytic Performance Assessment and K-means based Multicast Routing Algorithms and Architecture for 3D-NoC of Spiking Neurons,” ACM Journal on Emerging Technologies in Computing Systems (JETC), Vol. 15, No. 4, Article 34, October 2019. doi: 10.1145/3340963

10. Abderazek Ben Abdallah, A. Canedo, T. Yoshinaga, M. Sowa, “The QC-2 Parallel Queue Processor Architecture,” Journal of Parallel and Distributed Computing, Vol. 68, No. 2, pp. 235-245, 2008.