News

Abderazek Ben Abdallah

The University of Aizu
School of Computer Science and Engineering, 〒965-8580 Aizu-Wakamatsu, Japan

Phone: +81 242 37 -2574; Fax: +81-242-37-2595; E-mail: benab@u-aizu.ac.jp
Office: 202-AI Lab:202-E-F; Laboratory Website: ACSLAB

日本語版

Research

Groundbreaking contributions in designing and optimizing energy-efficient, high-performance computing systems, particularly targeting digital signal processing workloads with compute, network and high-availability constraints

Neuromorphic AI Circuits and Systems (energy efficiency, learning algorithms, anthropomorphic android, and hardware implementation)

Advanced On-Chip Interconnects

Emerging Trends (3D ICs; Silicon photonics; Edge computing IC design)
Reliability of Integrated Circuits and Systems (thermal management, environmental factors, soft/hard errors)

Computer Systems (processor architecture, embedded systems, SoCs, energy efficiency)

News

[2025.04.28] Our 2nd edition Book entitled ''Neuromorphic Computing Principles and Organization, 2nd Edition,'' Released!

[2025.04.16] A new patent (Nbr.7659250) has been granted (Title: Multiple error detection circuit detecting multiple errors in multiple links and error correction circuit having multiple error detection circuit

[2021/05/25] Our Off-grid AI-Enabled Energy Management Project Field Demonstration - research in collaboration with Aizu Computer Science Laboratory and Banpu Japan, 2021/05/25

[2024.10.25] [Our Lab, which is also affiliated with Carbon Neutral Laboratory, will present about ''AI-powered EV Energy Harvesting and Management'' at the Aizu IT Autumn Forum 2024, Oct. 25, 2024]

[2024.07.07] A patent has been granted for a non-blocking multiple-TSV defects localization method and architecture for 3D-ICs by Prof. Ben Abdallah Abderazek and Prof. Dang Nam Khanh of the University of Aizu, July 2, 2-24.

[2023.07.04] A new patent has been granted. 特許第7277682号 (May 11, 2023）Abderazek Ben Abdallah, The H. Vu, Masayuki Hisada,''Spiking Neural Network with 3D Network-on-Chip'', 特願2019-124541 (July 3, 2019)

[2023.04.17] A new patent has been granted. 特願2017-218953（特許第7239099号）Abderazek Ben Abdallah, Khanh N. Dang, Masayuki Hisada, "A TSV fault-tolerant router system for 3D-Networks-on-Chip," 特願 2017-218953 (2023.03.14)

[2018.12.08] Invited Talk, ''Artificial Intelligence Chips: From Data Centers to Edge an d IoT Computing'', 2nd Symposium on AI Center, The University of Aizu, December 8, 2018.

Last update: April 1st, 2025