- Groundbreaking contributions in
designing and optimizing high-performance,
energy-efficient computing systems, particularly
targeting digital signal processing workloads with compute, network and
high-availability constraints
- Computer Architecture
(processor micro-architecture, parallel computing,
energy efficiency)
- Reliability of Integrated
Circuits and Systems (thermal management,
environmental factors, soft/hard errors)
- Embedded Machine Learning
Systems (algorithm optimization, FPGA
acceleration, real-time processing, applications
exploration)
- Neuromorphic Computing
(energy efficiency, learning algorithms, hardware
implementation, applications exploration (i.e., audio,
BCI, object detection, activity recognition))
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- Off-grid energy
storage solar carport Demonstration research started
in collaboration with Aizu Computer Science Laboratory,
Banpu Japan, and the University of Aizu, 2021/05/25
- The press briefing on the off-grid
energy storage solar carport has been uploaded to
YouTube, June 16, 2021
- A new patent entitled ''A
non-blocking multiple-TSV defects localization method
and architecture for 3D-ICs'' by Abderazek Ben
Abdallah and Dang Nam Khanh has been granted (July 2,
2024)
- A new patent has been granted.
特願2020-094220（特 許第7488989号）Abderazek Ben Abdallah,
Khanh N. Dang, ''A three-dimensional system on chip in
which a TSV group including a plurality of TSVs
provided to connect between layers'', 特願2020-094220
(特許査 定受領日:2024年5月15日)
- A new patent has been
granted. 特許 第7277682号 (May 11, 2023）Abderazek Ben
Abdallah, The H. Vu, Masayuki Hisada, ''Spiking Neural
Network with 3D Network-on-Chip'', 特願2019-124541 (July
3, 2019)
- A new patent has been granted. 特
願2017-218953（特 許第7239099号）Abderazek Ben Abdallah,
Khanh N. Dang, Masayuki Hisada, "A TSV fault-tolerant
router system for 3D-Networks-on-Chip," 特願 2017-218953
(2023.03.14)
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